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AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging

04/16/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.

RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System

04/15/2026 | RTX
Raytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.

HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots

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HYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.

Scanfil Releases Second Sustainability Report: 2025 Progress and 2026 Ambitions

04/14/2026 | Scanfil
Scanfil has published its second sustainability report for 2025 in accordance with the Corporate Sustainability Reporting Directive (CSRD).

Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology

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Carbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.
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