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Commerce Secretary Howard Lutnick Visits TSMC Arizona Fabrication Facility for Third Fab Ground Breaking

05/02/2025 | U.S. Department of Commerce
U.S. Secretary of Commerce Howard Lutnick visited the Taiwan Semiconductor Manufacturing Company (TSMC) semiconductor fabrication facility in Phoenix, Arizona where the company broke ground on a third fab facility.

SIA Welcomes Legislation to Strengthen U.S. Semiconductor Manufacturing Credit

05/02/2025 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer welcoming House introduction of Building Advanced Semiconductors Investment Credit (BASIC) Act.

Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA

05/01/2025 | Summit Interconnect, Inc.
Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.

Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications

05/01/2025 | Cadence Design Systems
Cadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).

Vuzix Acquires Advanced Waveguide R&D Facility in Silicon Valley to Strengthen Partnerships with Big Tech OEMs/ODMs

04/29/2025 | PRNewswire
Vuzix Corporation, a leading supplier of smart glasses, waveguides, and Augmented Reality (AR) technologies, today announced the acquisition of an advanced waveguide R&D facility in Milpitas, California.
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