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Indium to Showcase Innovative Materials Powering AI Technology at Productronica China
March 25, 2025 | Indium CorporationEstimated reading time: 1 minute
As a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that enabling AI advancements at Productronica China, March 26-28, in Shanghai, China.
Indium Corporation’s GalliTHERM® portfolio of gallium-based liquid metal solutions builds on more than 60 years of expertise in manufacturing advanced gallium-based materials. Designed for both TIM¹ and TIM² applications, these liquid metal TIMs offer cutting-edge thermal interface performance with superior reliability. Liquid metal TIMs offer:
- High thermal conductivity versus polymers
- High purity enables excellent wetting to surfaces
- No soldering or surface metallization needed
Indium Corporation’s Solder Thermal Interface Materials deliver superior heat dissipation and high thermal conductance for power-dense devices. Indium has a high bulk thermal conductivity (86 W/m-K) which means less sensitivity to bond line thicknesses and coplanarity issues compared to polymeric TIMs. Indium’s ductility can accommodate differential thermal expansion with minimal stress on the interface making Solder TIM an ideal TIM1 or TIM1.5 where die or substrate warpage and CTE mismatch challenges are present.
Indium Corporation’s Heat-Spring® solutions provide an optimal TIM2 solution as a compressible, non-reflow metal TIM. In liquid immersion systems, Heat-Spring® is also a proven TIM compatible with all major immersion fluids that will not dissolve in Single–Phase or Two-Phase immersion cooling liquids. These indium-based TIMs deliver outstanding thermal conductivity compared to non-metal alternatives—with pure indium metal achieving 86 W/m·K in all directions. Due to its solid metal state, Heat-Spring® effectively prevents pump-out and bake-out issues while also supporting sustainability through Indium Corporation’s reclaim and recycle program.
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09/29/2025 | Indium CorporationIndium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
Teledyne Labtech Leads Groundbreaking Welsh Space Cooling Project with Bangor University
09/25/2025 | BUSINESS WIRETeledyne Labtech, a leading innovator in advanced electronic PCB solutions is spearheading a pioneering Welsh disruptive technology that could revolutionize thermal management in space electronics.
Indium Experts to Present on Thermal Interface Materials at IMAPS Microelectronics Symposium
09/24/2025 | Indium CorporationIndium Corporation experts will deliver technical presentations on thermal interface materials (TIMs) at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
Cohu Eclipse Platform Chosen for Testing Next Generation AI Computing Devices
09/19/2025 | BUSINESS WIRECohu, Inc., a global supplier of equipment and services optimizing semiconductor manufacturing yield and productivity, announced its Eclipse platform has been selected by a leading U.S.based semiconductor manufacturer & foundry services company for production testing of next-generation processor devices.
Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025
09/18/2025 | AismalibarAismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.