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4FRONT Solutions Invests in Seica’s PILOT V8 NEXT Flying Probe Tester to Enhance Test Capabilities at DeLand, FL Facility
May 16, 2025 | Seica, Inc.Estimated reading time: 1 minute

Seica, Inc. is pleased to announce that 4FRONT Solutions has purchased and installed a PILOT V8 NEXT Flying Probe Tester at its electronics manufacturing facility in DeLand, Florida. 4FRONT Solutions, a full-service Electronics Manufacturing Services (EMS) provider with locations in Erie, PA and DeLand, FL, specializes in delivering high-reliability solutions for the Aerospace, Defense, Industrial Controlsand Transportation industries. 4FRONT Solutions already has a PILOT V8 NEXT system in its Erie, PA facility, further strengthening its test capabilities across multiple locations.
The PILOT V8 NEXT’s vertical, dual-sided architecture enables simultaneous probing on both sides of the printed circuit board assembly (PCBA), optimizing efficiency and ensuring comprehensive, accurate test coverage. This dual-sided probing capability significantly enhances productivity while ensuring the high testing standards required for today’s advanced electronics manufacturing.
With this investment, 4FRONT Solutions strengthens its test and quality assurance capabilities, aligning with its mission to provide best-in-class PCB, Cable, and System Level Assembly services to customers who demand the highest levels of reliability.
“We are excited to continue partnering with Seica as we further enhance our manufacturing and test capabilities,” said Mike Sementelli, VP Sales and Marketing at 4FRONT Solutions. “The PILOT V8 NEXT will provide the speed, flexibility, and precision necessary to meet the rigorous demands of high-reliability industries, while also supporting future growth.”
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Brent Fischthal - Koh YoungSuggested Items
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/22/2025 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.
MacDermid Alpha Electronics Solutions Announces New Strategy Vice President Role for India
08/14/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce the appointment of Dr. Ravi Bhatkal to the newly created role of Vice President, Strategy, India.
Changes in Management Positions at Würth Elektronik eiSos Group
08/14/2025 | Wurth Elektronik eiSosWürth Elektronik, a leading manufacturer of electronic and electromechanical components for the electronics industry, announces two new appointments at the management level: Dirk Knorr has taken over the position of COO of the Würth Elektronik eiSos Group, and Sebastian Valet has taken over his previous position as Managing Director of Würth Elektronik eiSos GmbH & Co. KG.