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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 18, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference. As for my bonus piece, keep reading to see what the real buzz is about.
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
Published July 16
I had the opportunity to go in-depth with Martyn Gaudion, managing director at Polar Instruments and a three-time author in the I-Connect007 book series, on his latest installment, The Printed Circuit Designer’s Guide to…More Secrets of High-Speed PCBs. We discuss the book’s contents, why it was important to continue the topic, and who should get a copy. As always, adding the author’s personal voice and perspective adds insight and understanding.
Copper Price Surge Raises Alarms for Electronics
Published July 15
The Global Electronics Association is reporting major turbulence in the copper market following the Trump administration’s announced 50% tariff on imported copper, slated to start Aug. 1, 2025, as reported here. Most of the copper used in the U.S. is sourced from the Americas, but the news was enough to cause a surge in the copper market.
TTM Technologies Prepares For the Future with the Acquisition of a Facility in Wisconsin and Land in Penang
Published July 10
TTM just added 750,000 square feet of manufacturing space in Eau Claire, Wisconsin, where TDK was the previous owner of the building. This is in addition to a land purchase in Malaysia slated for further growth. This article provides a ton of details, shedding insight on how TTM plans to respond to shifting regional dynamics worldwide.
Report: Broadcom Scraps $1 Billion Chip Investment in Spain
Published July 15
In what I would interpret as a setback for EU supply chain resilience, Broadcom has ended its plans to build a plant for final assembly and testing of ICs in Spain. Collapsed government talks were the reason given by Broadcom. Get more details here.
Digital Twin Concept in Copper Electroplating Process Performance
Published July 11
Periodically, we publish a significant research paper in our magazines. These papers address an area of development we determine to be of particular practical interest to readers. Aga Franczak’s paper from the 2025 Pan-European Design Conference takes a hard look at improving copper thieving performance through use of a digital twin for the copper plating process. Industry 4.0 and digital twin concepts made early inroads in assembly, now researchers are using those concepts to improve board fabrication. For readers interested in fabrication, this is an important read.
BONUS!
Nvidia’s $4 Trillion Milestone Signals AI Must-have for Investors
Published July 10
I’m including this news item as a bonus sixth, because a market cap of $4 trillion simply cannot be left unnoticed. Nvidia is now the most valuable business on Earth. While that is sinking in, read all about it here.
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Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
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Understanding Tolerances in Flexible Circuit Design
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Target Condition: An Exploration of Flooding PCB Layers
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New, Greener Solutions for Etch: Novel Copper Extraction
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