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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Avary Holding, a Subsidiary of Zhen Ding, Board Approves Huai’an Park Investment
August 22, 2025 | Zhen DingEstimated reading time: 1 minute
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced on behalf of its subsidiary, Avary Holding (Shenzhen) Co., Ltd., that the Board of Directors has approved the Huai’an Park investment plan. From 2H2025 to 2028, the company will invest RMB 8 billion (approximately NT$33.5 billion) to expand high-end PCB capacity, providing comprehensive PCB solutions across rapidly growing AI applications, including servers, optical communications, humanoid robots, smart vehicles and edge AI devices.
Zhen Ding previously indicated that in response to rising demand for advanced AI products, its capital expenditures in 2025 and 2026 will increase to over NT$30 billion annually. The Huai’an Park investment is a key component of the Group’s overall capex strategy, involving the construction of two new fabs and procurement of advanced equipment. The primary focus will be on expanding high-end MSAP, HDI, and HLC capacities to meet mid-to long-term demand for high-layer-count and highprecision PCB designs.
Zhen Ding noted that order momentum in AI servers (including GPU and ASIC platforms) and optical communications has strengthened significantly, with contributions expected to continue rising. In addition to the Huai’an investment, Zhen Ding is simultaneously advancing capacity expansion in Thailand’s Prachinburi Park and Kaohsiung AI Park, building critical capacities required to support the growth of AI computing power.
Zhen Ding emphasized that the Huai’an expansion will further strengthen its “One ZDT” integrated advantage by aligning advanced processes, cross-product synergies, and global resource allocation.
This expansion will not only enhance the company’s high-end PCB capacity and technological depth but also deepen collaborations with leading global AI application companies, reinforcing Zhen Ding’s leadership position in the global PCB market.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
Separating Fact from Fear on the FCC ‘China Lab Ban’
05/14/2026 | Jan Pedersen, NCAB GroupRecent news headlines have suggested that the U.S. Federal Communications Commission (FCC) has “banned all testing laboratories in China and Hong Kong.” Understandably, this has created concerns around PCB testing, material approvals, UL listings, and the continued use of established test laboratories in Asia. The good news is that for most PCB, PCB material, and PCBA testing, nothing has changed. Let’s separate fact from fear.