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Suggested Items

A Designer's Focus on High Density

04/30/2026 | Marcy LaRont, I-Connect007 Magazine
Vern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.

ASC’s John Johnson Bullish on the U.S. and High-tech PCBs

04/28/2026 | Marcy LaRont, I-Connect007
It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.

It's Only Common Sense: See Your Marketing as a Discipline, Not a Department

04/27/2026 | Dan Beaulieu -- Column: It's Only Common Sense
What does marketing mean to you? Is it a corner office with cool posters on the wall? Is it the person running your LinkedIn page or the trade show booth with the shiny graphics and the bowl of candy? Yes, marketing is those things, but it’s more than that. It’s a discipline, and if you treat it like a department, you’re already losing.

Marcy’s Musings: Operating Without a Rulebook

04/15/2026 | Marcy LaRont -- Column: Marcy's Musings
What happens when the rulebook is no longer useful, or worse, has not yet been written? With electronics innovation happening at warp speed, we’re increasingly asked to design and build what has no precedent, proven path, or tidy checklist to follow. “Design for invention” begins at the edge of known capability, where traditional DFM gives way to something far less certain, and far more exciting. It’s not about breaking rules for the sake of it; it’s about recognizing when the rules no longer apply and having the insight, collaboration, and courage to move forward anyway.

EIPC Winter Conference Review: A Focus on Miniaturization

02/12/2026 | Pete Starkey, I-Connect007
The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.
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