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Role of the Interfacial Intermetallic in Lead-Free Solders
October 1, 2009 |Estimated reading time: Less than a minute
Keith Howell, Technical Director with Nihon Superior USA, sits down with Editor Ray Rasmussen on the show floor at IPC Midwest 2009 to discuss the role that interfacial intermetallic plays with various solder alloys. Howell delivered a paper on the topic during the show.Watch the interview here.