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productronica 2009: Product Showcase
December 31, 1969 |Estimated reading time: 6 minutes
Preview of The Exhibit Halls
An end to end software suite, DynamiX is designed to integrate solutions that will assist manufacturers in design, planning, monitoring, control, scheduling, box build, traceability, test, and rework processes. The software covers receipt of goods into the production inventory locations through PCB assembly and test, full system assembly and test, and fin al packing of the finished goods ready for shipment. The DynamiX suite of products has been designed to form a comprehensive manufacturing execution system (MES), focusing on discrete manufacturing in the electronics production industry. The Valor MES platform can incorporate integrated functionality, single MES++Platform, flexibility and the DynamiXPortal. Features include vPlan for SMT programming and data management, multi-vendor line balancing, program optimization and process setup documents; vManage for SMT/PCB materials control, material verification and traceability and warehouse and shop-floor management; and vCheck for PCB test with repair loop control, AOI/ICT direct interface, data management and reporting system. Valor Computerized Systems NV, A3. 421.
The i-SAC lead-free solder alloy series includes i-SAC 387, with the addition of Co and Ge; and tin/silver-based i-SAC105. The melting characteristic of the silver-containing alloy was improved with cobalt for shiny joints with a fine grain microstructure. i-SAC387 also has germanium as an antioxidant. The alloy's melting point is 217°C with specific gravity of 7.5 g/cm3. i-SAC105 offers silver composition on request between 0.5 and 1.5%. Solder joints are bright and shiny with fine-grain microstructure. Cobalt and germanium improve low-silver-alloy performance. i-SAC105 has a melting point of 217° to 227°C and a specific gravity of 7.4 g/cm3. The BALVER ZINN Group, A4.570.
The SIPLACE SX placement machine has gantries that can be installed or de-installed in a few minutes. Measuring 1.5 m long, the machine holds 120 8-mm intelligent SIPLACE feeder modules. SIPLACE X feeders can be mounted and dismounted without having to stop the machine. In combination with the new SIPLACE MultiStar CPP head, which always selects the best placement mode (Pick&Place, Collect&Place or the highly flexible mixed mode), SIPLACE SX lines are balanced without reconfigurations. If necessary, gantries can be easily moved between placement machines and between lines. Siemens Electronics Assembly Systems (SEAS), A3.377.
The portable Break Out Box PTE-100, designed for 1st-level functional test (FT) has strong stimuli/measurement capabilities. Based on Seica's standard VIP architecture, including the DSP ACL module, the PTE-100 combines the features of different instruments like voltage generator, current generator, waveform generator, voltmeter, amperometer, frequency meter, and oscilloscope, with the typical features of an automatic test system. It is also equipped with a mid-range power relay matrix (500V @2A) with switching and interrupt functions of up to 256 I/O channels. The PTE-100 suits diagnosing and identifying field faults in systems made up of electronic modules interconnected through cables equipped with break-out connectors. The PTE-100 is connected between two modules to monitor the activity present on the interconnect cable, and can execute stimuli/measurement operations as well as connect/interrupt every single wire of the cable itself to facilitate diagnosis. Seica "Quick Test" software provides a graphical, easy to use interface. PTE-100 can be used in the manual mode typical of a lab instrument or in an automatic "ATE" mode, executing previously stored test sequences. Seica S.p.A., A1.548 and B2.125.
Verification and diagnosis of complex switching operation in a test system has always been an issue, especially in the PXI platform. Built in self test, called BIRST, or Built In Relay Self Test, will be applied to select PXI machines. The BIRST tool allows the user to check system switching operation on command. BIRST will identify any relay failures in the switch module and is capable of detecting relays with deteriorating contacts which may indicate they are in the process of failing. To conduct a test the user simply disconnects the switching module from the UUT and runs the supplied application program; no supporting test equipment is needed. The first range of modules with built in self test include 40-560A, 50-561A, 40-562A, 40-563A, 40-584, 40-585, 40-586, 40-587, 40-527, 40-528, and 40-529. The BIRST solution will be applied to other Pickering Interfaces PXI modules and the LXI product family. Pickering Interfaces, A1.344.
Debuting in Europe, the MC-24 placement machine is capable of running single- or dual-lane production. It occupies 2 sq.m. of floor space and can place at up to 72,000 CPH. The ultra-slim and intelligent electrical feeding platform, introduced with the MC series, allows up to 120 feeders per machine. In combination with the fine pitch equipment, such as the MC-1 or MC-8, over 240 feeder positions are available on production line level. The MC-24 handles a component range from 0.4 × 0.2 mm (01005) to 32 mm2 and boards up to 700 × 460 mm. High mix needs such as fast NPI and changeovers, family, and scheduled set ups are aided by the Assembléon Manufacturing Suite's virtual sticky tape, easy editors, and set up assistant features. Various optimization modes enable best-possible set up. Assembléon, A2.477.
The SP210avi printer offers a small footprint with high capabilities and quality. It includes internal storage for squeegees and consumables. It is designed for medium and high throughput, high-mix applications. The SP700avi Printer for standard 737mm (29") stencil frame. The SP700avi is available with a wide range of options, including 2D paste inspection, SPC data collection and 3 tooling options, including Speedprints unique laser tooling system and the new Vacunest tooling package. Both systems use Speedprint's "look down, look down" vision alignment. Twin roving cameras mounted on independent X,Y, gantries ensure accurate and repeatable precision alignment, using fiducial marks or PCB/stencil features. Selective Auto-Paste Dispense technology is fully programmable. The advanced intelligence of the twin camera vision system analyzes the stencil to see where paste is required and the dispenser deposits it accordingly. The SP210 series incorporates 3Di, an advanced user interface with self diagnostic capabilities, such as production logging and automatic fault report generation. Automatic rail width adjust is standard; stencil loading is automatic, and the system does not require adaptors for varying sizes of stencil frames. Speedprint Technology Ltd., a division of Blakell Europlacer Group, A2.439.
The S3088-III AOI system targets fast, accurate solder joint inspection. Inspectable PCB dimensions were significantly enlarged; the camera technology improved; and the latest software release added. The AOI system enables economical assembly inspection from prototype to large series. It can be deployed for paste print or placement inspection as well as solder joint inspeciton. Defects on 01005 components are detectable in high resolution mode. The revised PCB transport now accepts boards up to 508 × 508 mm. The scope of the color evaluation was also widened to include angled inspections. Extended lifted lead detection reduces false alarms caused by poorly stamped edges. Software modules include switchable resolution with the OnDemandHR function or Integrated Verification for automatic inspection program optimization. The AOI system can be used as an inspection island or deployed in-line. Viscom, A2-177.
Highest possible fault and test coverage will be demonstrated by combining several test technologies in the company's portfolio: JTAG/boundary scan, automated inspection (AOI/AXI), functional test, ICT, and digital image processing. Among others, the combinations ICT/Boundary Scan/Functional Test, Functional Test/ICT, or Boundary Scan/AOI will be demonstrated on several systems. In AOI/AXI, the company will showcase double-sided in-line AOI for THT in the OptiCon TurboLine; an integrated double-sided AOI option for the X-ray inspection system OptiCon X-Line 3D; and the new "BScan Ready" option for all AOI system from (all inspection systems will feature a Boundary Scan integration option due to customer request). An improved Lifted Leads recognition with the angled-view module "Chameleon" for layout independent fault detection at excellent image quality will be introduced. GÖPEL electronic GmbH, A1.239.
FREE-SAT pre-saturated wipes for Class 1000 (M4.5) and higher applications comprise 70% isopropyl alcohol/30% deionized water. They feature ultra-low lint and non-volatile residue. The low-static-charged wipes use NOVA-TECH 1000 material, cellulose reinforced with polyester fibers. FREE-SAT wipes are economically priced and available as a custom product. No wipes are exposed in the container and the dispensing hole has no sharp points. Pre-saturated Cleanroom Select-Sat Wipes are dry wipes that absorb the user's chosen solvent, eliminating shelf life concerns. High-Tech Conversions Inc., A2.535. SMT