-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
From the Show: Head-in-pillow Defects Presentation
March 31, 2009 |Estimated reading time: Less than a minute
LAS VEGAS Soldering defects are immensely important to electronics assemblers, particularly those in high-reliability industries. Today at the APEX technical conference, Indium's Mario Scalzo will present on head-in-pillow defects.
Scalzo, senior technical support engineer, authored "Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly," which discusses the two main sources of head-in-pillow defects and solutions for their elimination.
The presentation will take place today, March 31, from 1:30 to 3:00pm.
To see an image of head in pillow, read editor Gail Flower's Solder Paste Basics: A Round-up.
For more information, or to view the schedule of events, visit www.goipcshows.org, or read IPC APEX Expo Preview: Innovative Technology Center, Task Groups, and MoreIPC APEX Expo Preview: Technical Courses and TutorialsGet Ready for APEX: Preview of Technical Sessions and Noteworthy Events