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From the Show: APEX Cleaning & Alternatives Subcommittee
March 30, 2008 |Estimated reading time: 1 minute
LAS VEGAS The exhibition hall doesn't open until Tuesday, but the IPC APEX technical conference is underway today, with the Cleaning and Alternatives Subcommittee taking place from 8 to noon. Mike Bixenman, DBA, Kyzen and William Kenyon, Ph.D., Global Centre Consulting, host the session, part of the Standards Development Meetings at the tradeshow in Las Vegas. Following is a brief description of the committee goals.
This subcommittee is combining and updating four cleaning handbooks into a single document. The base documents are IPC-SC-60, "Post Solder Solvent Cleaning Handbook;" IPC-SA-61, "Post Solder Semi-Aqueous Cleaning Handbook;" IPC-AC-62, "Aqueous Post Solder Cleaning Handbook;" and IPC-CH-65, "Guidelines for Cleaning of Printed Boards and Assemblies."
The pace of technology development and innovation has created an expectation that products will perform upon demand. Technology advances create the need for highly complex circuitry driven by improved performance, miniaturization, and circuit density, the session leaders explain. Manufacturing complexity increases with the continuous drive for smaller, lighter, and more advanced features. The subcommittee meeting addresses the benefits and tradeoffs of innovative cleaning fluid designs for cleaning leading edge technologies.
For more information, or to view the schedule of events, visit www.goipcshows.org.
SMT editors Meredith Courtemanche and Gail Flower will be reporting from the show floor throughout APEX. Look for coverage at smtonline.com and check out the editors' blog at smt.pennnet.blogs/smt/index.cfm.