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Seika Intros SAWA Ultrasonic Stencil Cleaner
November 11, 2008 |Estimated reading time: Less than a minute
TORRANCE, Calif. Seika Machinery Inc. launched the SC-5000 tabletop ultrasonic stencil and misprint cleaner as part of its SAWA platform of products. The system features cleaning head, generator, foot pedal, 32 × 32" tray and 30 foam pads.
The SAWA 5000GUS removes solder balls from stencil apertures after normal wipe cleaning. A handheld ultrasonic cleaning head is applied manually over apertures with any solvent. During application of the cleaning head, the stencil is laid on a foam pad soaked with solvent contained within a large tray. The foam is used to capture solder balls dislodged by the cleaning head. A similar method is utilized for cleaning misprinted bare boards.
SAWA ultrasonic systems reportedly are environmentally friendly, fast, safe, economical, and effective for fine-pitch stencil cleaning. SAWA cleaner evaluations and product details are available on the company's Website.
For more information, visit www.seikausa.com.