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New Products in SMT
December 31, 1969 |Estimated reading time: 4 minutes
Following are the upgrades, replacement parts, new cleaning materials, thermal interface products, board handling systems, sockets, assembly lines, and other next-generation products from Manncorp, Aries, Essemtec, Zestron, Novatec, and more.
Aries Electronics updated its CSP/BGA test and burn-in and RF sockets, from 13 to 55 mm2 models, to accommodate devices with pitches down to 0.3 mm. They suit use with a range of CSP, microBGA, DSP, LGA, SRAM, DRAM, and flash devices. The standard molded socket format enables each socket to accommodate any device package size. The RF test sockets can be easily mounted to and removed from the PCB, and the CSP/BGA test and burn-in sockets can be conveniently mounted to and removed from the burn-in board (BIB). The sockets offer gold-over-nickel plated compression spring probes. The pressure pad compression spring allows for height variations in device thickness. The RF socket includes "scrub" on solder balls with raised tip probes that provide "scrub" on pads. The sockets accommodate up to 500,000 cycles and operate at temperatures of -55° to +150°C. The CSP/BGA test and burn-in and RF socket versions are available in custom materials, platings, sizes and configurations to suit specific customer applications. www.arieselec.com.
IBE SMT Equipment is offering LCD replacement monitor kits for Fuji SMT equipment. Defective and outdated CRT monitors can be replaced with brighter, easier-to-read LCD monitor, for reportedly lower costs than OEM replacement. The kits includes cables, mounting brackets, LCD monitor, and an installation manual. The IBE kit was designed to replace monitors in the following Fuji equipment CP 4-4000, CP 4-2, CP 4-3, CP 6-4000, CP 642, CP 643, IP 1, IP II Series, IP-III, QP 242, GL II, GL V-5000, GL 541E, GSP II, GSP III, and GP 341. www.ibesmt.com.
Essemtec AG worked with leading suppliers of die bonders to develop an economical solution for efficient placement of special components on film or flex boards. The FLX2011machine concept is based on the FLX2010C. The placement solution features a conveyor system that allows for flexible and fast placement operations on the substrate. The substrate itself, a sandwich piece consisting of an aluminum carrier with the film and downholder, will be located on the conveyor and moved into the placement position. The FLX2010C can be placed upstream in the line before a die bonder, or in a downstream pick-and-place process, where the special components will be placed on die, a sandwich carrier will be inserted and stopped by means of a "stopin" mechanism. The carrier is located securely with a chuck. Nozzles suck in from the underside of the sandwich carrier at defined positions to prevent shifting during placement. Film substrates can be populated from conventional component feeder systems after the alignment of the fiducials. www.essemtec.com.
Manncorp's economy line.Manncorp offers the "Economy Turnkey Line," comprising a full-vision 4,000 CPH pick-and-place machine, a vertical-lift stencil printer, and multi-zone lead-free reflow oven. The line includes a MC384 pick-and-place system, with Cognex on-the-fly vision and bottom vision for larger components. It features a 128-lane feeder capacity and the ability to mount 0201s, CFPs and microBGAs. The 5500 stencil printer features independent, pressure-controlled dual squeegees and an ergonomic pneumatically controlled stencil frame that opens automatically after each cycle. Single or double-sided PCBs can be processed. The CR5000 forced-hot-air convection reflow oven features five independent upper and lower heat zones and attains lead-free processing temperatures to 300°C and includes a combination edge-pin and belt conveyor. www.manncorp.com.
Virtual Industries Inc. introduced the V3025-B vacuum interrupter. This tool can be used with any one of Virtual Industries' vacuum sources or with an in-house vacuum system. Its function is to assist in precision placement of small parts. The interrupter block controls the vacuum. The hand that holds the vacuum tweezer pen is used to accurately position the part being placed while the other hand is free to tap the interrupter button, releasing the part. Complete kit includes a vacuum pen, two pieces of hose and the vacuum control block. vacuumtweezer.com.
ZESTRON America debuted a water-based defluxing agent for spray-in-air processes with low- to medium-pressure cleaning applications with long exposure times. VIGON A 250 is an MPC cleaning agent recommended for removing difficult leaded and lead-free flux residues from electronic assemblies in batch cleaning systems as well as in centrifugal and ultrasonic cleaning applications. Its high bath loading capacity ensures extended bath life, low maintenance cost, and reduced cost per cleaned part. Due to the surfactant-free formulation, VIGON A 250 eliminates the formation of white residues on cleaned parts and cleaning equipment and time-consuming surfactant monitoring. VIGON A 250 is a biodegradable aqueous cleaning agent and is free of halogenated compounds, meets RoHS and WEEE guidelines as well as current worker safety standards, and is free of banned hazardous substances. The cleaning agent passed current electronic manufacturing industry standards such as IPC-610A, J-STD 001D, IPC-TM 650, and J-STD 003. www.zestron.com.
Novatec updated its VacuNest shape memory board support system with a next-generation solution for large-area products such as backplane applications. Large board products up to 450 × 450 mm include advanced technology backplanes, solar and fuel cell panels, and multiple substrate printing jobs. The VacuNest handling product is designed to eliminate problems associated with conventional dedicated or programmable pin tooling systems, optimizing manufacturing productivity and eliminating component damage. The Shape Memory Tooling technology spreads support forces over the board. Each module consists of a pliable, anti-static chamber containing a foam former surrounded by polymer granules. The chamber can be rapidly profiled to match the contours of different populated board undersides. Under vacuum, that profile can be locked into place indefinitely without shrinking. By releasing the vacuum, manufacturers reset the nest as an elastic material. Available in a range of modular sizes and configurations, VacuNest suits use on a variety of printing, dispensing, and pick-and-place technologies. www.novatec-eap.com.