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Carrier Technology Ups Throughput
July 12, 2007 |Estimated reading time: Less than a minute
SAN JOSE, Calif. DEK introduced Virtual Panel Carrier (VPC) substrate centering and carrier technology, based on its virtual panel tooling (VPT) high-throughput substrate-imaging system. VPC enables multiple component support and alignment during screen printing and subsequent assembly processes.
The product's design comprises a base carrier with a low-maintenance consumable foil. It reportedly offers stability, centering, and alignment capabilities required to process multiple substrates or components in a single panel. The system targets processing more units per hour (uph) and higher throughput. Parts are placed in the carrier either manually or loaded with a placement system. Substrates are held in the carrier with a proprietary four-sided tensioning mechanism and then aligned within the carrier using a centering system. Parts are referenced using two global fiducials. The system is scalable.