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Electronics Epoxy Withstands 205235°C
July 5, 2007 |Estimated reading time: Less than a minute
HACKENSACK, N.J. Master Bond Inc.'s EP33 room-temperature-cure epoxy adhesive suits high-temperature bonding applications between similar and dissimilar surfaces. The epoxy is said to offer good physical and dielectric properties for strong bonds and resists thermal cycling, chemical deterioration, and concentrated radiation.
The polymer adhesive produces bonds exceeding 220-Kg/cm2 shear strength between metals, glasses, ceramics, and plastics; and maintains them in temperatures up to 235°C. With reportedly good electrical insulation and dielectric capabilities, the product can cure at room temperature, or at 95°C for cure times within one hour. The two-component epoxy is available premixed in bi-packs, in cartridge/gun packs for dispensing, or in bulk containers. It suits electronic, electrical, computer, and other industrial applications.