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Cornerbond Underfill Targets CSPs, BGAs
March 8, 2007 |Estimated reading time: Less than a minute
IRVINE, Calif. Loctite 3508 Cornerbond underfill system from the electronics group of Henkel offers epoxy underfill for chip-scale package (CSP) and BGA devices processed in lead-free environments. The underfill suits inline dispensing and allows IC components to self-align during reflow.
The product is a one-component epoxy that is pre-applied to the board at the CSP pad site corners. It can be incorporated into standard dispense systems and kept in standard storage. Curing takes place during normal lead-free reflow.
It boasts a six-month shelf life and 75-hour pot life. Adhesive strength is higher than prior generations and underfilled components are reworkable. The product enables inline underfill for assembly of mobile products, laptops, gaming consoles, and other end-products, Henkel noted.