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Non-conductive Paste Underfill
December 31, 1969 |Estimated reading time: Less than a minute
A non-conductive paste (NCP) underfill and encapsulant, Hysol FP5110 adheres flip-chip image sensor modules to two- and three-layer flexible printed circuits. The paste bonds to polyimide and epoxy adhesive materials. The product can be dispensed automatically, uses a 10-second cure at 180°C, and can be stored at -15°C.
By bonding bumps onto the substrate with lead-free-compatible thermal compression, the paste reportedly eliminates flux application, reflow, and cleaning. It can be used as a substitute to manual anisotropic conductive film (ACF), targeting image sensor applications, particularly in mobile phones. electronics group of Henkel, Irvine, Calif., www.henkel.com.