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Signal Integrity Improved with Embedded Passives
February 21, 2007 |Estimated reading time: Less than a minute
LOS ANGELES Sanmina-SCI Corporation of San Jose, Calif., introduced its approaches for improving the signal integrity of high-speed data links at Booth 865 at IPC Printed Circuits Expo/APEX/Designers Summit, February 2022 in Los Angeles.
The company highlighted MTS-Via technology, which uses embedded passives to avoid backdrilling via stubs on high-speed PCBs and backplanes. Match terminated stub (MTS) incorporates a printed resistor on internal layers of the PCB to terminate stubs and eliminate parasitic resonances. The MTS-Via product is used in conjunction with Opti-Via, a complementary technology that is said to optimize internal layer features for improved signal integrity.
At the booth, the company's technologists and research personnel will address issues and problems facing designers in high-performance laminates, embedded passives, microvias and high-density interconnects (HDI), signal integrity, backplane technology, and RoHS/lead-free compliance.