-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
"IPC Midwest" Abstracts Requested
February 2, 2007 |Estimated reading time: Less than a minute
BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries issued a call for participation requesting abstracts and proposals for the inaugural IPC Midwest Conference and Exhibition, September 2528, 2007, in Schaumburg, Ill. Researchers, academics, technical experts, and industry members are encouraged to propose paper presentations or half- or full-day courses by April 18, 2007.
Presentations are sought on electronics manufacturing, including lead-free topics such as tin whiskers and joint reliability; board design issues such as embedded passives and fine pitch; materials, including laminates, high-frequency laminates, and testability; fabrication topics such as plating technology, flex, rigid-flex, and vias; and assembly technology, such as rework-and-repair and no-clean. Half- and full-day courses will focus on design, PCB and electronic manufacturing processes, or materials.
Interested attendees can submit abstracts online at www.IPCMidwestShow.org, or contact Alexandra Curtis at (847) 597-2877.