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Soldering, Critical Issues Examined at APEX
November 16, 2006 |Estimated reading time: Less than a minute
BANNOCKBURN, Ill. More than 50 full- and half-day courses will provide IPC Printed Circuits Expo/APEX/Designers Summit 2007 attendees with practical information on current and future critical issues. The educational courses will take place February 18-19, 22 in Los Angeles, Calif. Program coordinators intend to create an information exchange for attendees to learn from peers, analyze common problems, and develop strategies from peer insights.
Advances in technology, lead-free, RoHS-compliance (along with other regulatory directives), and other areas will be presented, along with courses on design, assembly processes, PCBs, materials, and other topics. Options include lead-free soldering: materials, processes, troubleshooting, and reliability; base material basics; fundamentals of solder joint reliability; and due diligence documentation: more than materials declaration.
For complete course listings, visit the professional development courses website or contact the IPC at alexandracurtis@ipc.org.