-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Cookson Technology Group Solves Assembly Issues
August 11, 2006 |Estimated reading time: Less than a minute
JERSEY CITY, N.J. Cookson Electronics Assembly Materials announced it has established a global applications technology and engineering group, which joins its global R&D group. This effort formally integrates the company's field engineer network knowledge base into its internal applications structure. The global technology group will help Cookson's customers in solving assembly technology, yield, and reliability problems using the company's process dynamics, internal testing, and validation capabilities.
Companies find practical challenges in assembly processes as lead-free production becomes a daily reality, said Steve Brown, director of global applications technology, Cookson. The group will collaborate with field applications engineers and use two fully-automated SMT and wave soldering lines, with automatic solder paste inspection, to recreate and analyze problems. This capability within the Cookson Electronics labs will be available for Cookson test vehicles or customer-specific PCBs.