-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Modular Fuses
July 26, 2006 |Estimated reading time: Less than a minute
SANTA ROSA, Calif. The USI chip fuse series from Schurter features a range of universal modular fuses (UMFs) approved by the IEC, cURus, METI, and CCC. The series' 1206 package measures 3.2 × 1.6 × 0.6 mm. The fuses support lead-free reflow soldering or vapor-phase processes. Manufactured on tape with individual markings, the fuses incorporate a thin-film technology to produce predictable and stable yields.
With an operating temperatures range of - 55°C through to + 90°C, the USI devices provide secondary current protection in power inverters and low-voltage power supplies. They suit portable medical devices and sensor-rich in-car electronics, as well as other electronic systems.
The series features high melting l2t values, allowing greater resistance to high-inrush or pulse currents. The chip's opening time is reportedly comparable to time-delay types with 1206 footprints, but responds quickly to higher overcurrents. Chip fuses are rated from 0.5 6.3A with 63 VDC and 32 VAC voltage ratings.