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Quantum Leaps: Winners of Airbus and BMW Group’s Quantum Computing Challenge Unveiled

12/12/2024 | BUSINESS WIRE
Airbus and BMW Group have pushed quantum computing forward another step to leverage its significant potential for future mobility solutions. At Q2B, the companies have unveiled the winners of the Quantum Computing Challenge, an international initiative to identify and mature quantum solutions for the most promising mobility applications.

Working on a Personal Level at Stellar Technical Products

12/11/2024 | Nolan Johnson, SMT007 Magazine
Making the world a better place isn’t just a snappy slogan to put on their marketing collateral for Southern California-based distributor Stellar Technical Products. CEO Mike Min is looking for partners that want to optimize their bottom line, increase their resilience, and create a more sustainable planet. It’s the mission statement for the company, and Mike is working diligently to take that message forward. In this interview he shares the qualities that make Stellar Technical unique.

Real Time with... electronica 2024: STARTEAM GLOBAL Meeting Challenges Head-on

12/11/2024 | Real Time with... electronica
STARTEAM GLOBAL CEO Daniel Jacob and CTO Martin Schneider speak with Pete Starkey at electronica 2024 about their global presence in China, Thailand, and Europe, and how additive manufacturing and inkjet printing are keeping this PCB manufacturer at the forefront of technology. They’re excited about sustainability, the future, and competing on the world stage.

Fresh PCB Concepts: PCB Plating Process Overview

12/12/2024 | Team NCAB -- Column: Fresh PCB Concepts
In this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.

Happy’s Tech Talk #35: Yields March to Design Rules

12/12/2024 | Happy Holden -- Column: Happy’s Tech Talk
Ultra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”
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