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Transfer Adhesive Reacts to Heat & Pressure
July 18, 2006 |Estimated reading time: Less than a minute
WINDSOR, Conn. Thermofilm H194U, a nitrile phenolic thermosetting transfer adhesive from Scapa North America, activates and cures when exposed to heat and pressure bonding polyimide to copper foil on flexible printed circuits. The material also adheres to polycarbonate and ABS for electronic case and cover assembly applications.
Thermofilm H194U is said to provide high bond strength for a range of electronics assembly applications. When cured at 150°–250°F, it is resistant to solvents, plasticizers, and heat. The transfer adhesive is suitable for laminating PVC, polyester, aramid films, and plasticized materials. Scapa North America develops specialty adhesive films, tapes, and compounds for several markets, including aerospace, automotive, electronics, and medical.