-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Workshop Assists with Tin Whisker Prevention
April 19, 2006 |Estimated reading time: Less than a minute
HERNDON, Va., and PISCATAWAY, N.J. — The International Electronics Manufacturing Initiative (iNEMI), together with the IEEE Components, Packaging, and Manufacturing Technology Society (CPMT), will sponsor the 3rd Annual Tin Whisker Workshop and the 56th Electronic Components and Technology Conference (ECTC), May 30, 2006, in San Diego, Calif.
Workshop attendees will receive an update on recent activities in tin whisker testing and modeling. A roundtable discussion will cover implementation of the JEDEC/IPC specifications related to tin whiskers, including: JESD201, "Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes;" JEDEC/IPC joint publication JP002, "Current Tin Whiskers Theory and Mitigation Practices Guideline;" and JESD22A121, "Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes."
The workshop will help pinpoint strategies to ensure that long life-cycle applications will not succumb to tin whisker failures, and will discuss remaining risks and the implementation of current specifications.
Ron Gedney, iNEMI consultant, will chair the workshop; Maureen Williams, mechanical engineer for NIST, will co-chair; and Henning Leidecker, Ph.D., chief engineer of the Parts, Packaging, and Assembly Technologies Office of NASA, will moderate. For more information about the workshop, please click here.