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High-density Interconnect Arrays Available
February 15, 2006 |Estimated reading time: Less than a minute
NEW ALBANY, Ind. — The SEARAY high-density interconnects (SEAM/SEAF Series) from Samtec Inc. provide a solid grid of contacts on 1.27-mm pitch and up to 500 I/Os. A selection of solder crimps on the tails provide a choice between tin/lead alloy or RoHS-compliant, tin-only alloy for lead-free processing.
Available stack heights are 7, 8.5, and 10 mm, along with array sizes of eight or 10 rows by 20, 30, 40, or 50 pins per row. Pins may be routed either single-ended or differentially — performance at a -3 dB insertion loss is 4 GHz for single-ended applications and 9 GHz for differential-pair applications.