-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Image Processor Software Optimized with SMT/BGA Capabilities
January 26, 2006 |Estimated reading time: Less than a minute
SAN DIEGO — Adding to the Verifier Image Processor (VIP) Application Software series, FocalSpot introduced the VIPx, featuring an extended set of advanced SMT/BGA inspection capabilities and image enhancement tools.
VIPx is a PC/Windows XP-based image processor that delivers solder joint-, package-, and PCB-level diagnostic software capabilities for enhanced visualization, precise measurement, and user-defined analysis of SMT/BGA solder joints, PCBs, components, mechanical parts, and electrical interconnections. VIPx is suitable for upgrading most X-ray inspection systems with PC-based functionality.
The BGA analysis module finds BGA connections automatically and measures ball diameter, area, void, and solder amount. Rules can be set to find bridging, opens, voids, no- or low-solder areas, and poor reflow. The SMT analysis module finds and measures the solder area, voiding, and solder amount automatically. Rules can also be established for defect detection. The custom analysis module will draw out irregularly shaped objects or regions of interest with the mouse to measure solder and void content. The package analysis module measures wire sweep and wire-loop heights, while the PCB analysis module measures drill offset and inner-layer mis-registration. X-ray images can be sharpened, relieved, colored, and plotted three-dimensionally using the image enhancement analysis module.