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Free Webinar to Tackle 0201 and 01005 Assembly Hurdles
January 23, 2006 |Estimated reading time: Less than a minute
FRANKLIN, Mass. — Speedline Technologies will discuss the issues involved in the 0201 and 01005 component assembly process in a free, live, hour-long Webinar, to take place February 16, 2006, at two different times: 2:00–3:00 a.m. EST, and 11:00 a.m.–noon EST.
The continuing demand for smaller, lighter portable products has propelled using miniature components throughout the electronics industry. Two packages, currently being used for resistors and capacitors, are the 0201 and 01005 chip component packages. Assembling these components presents a number of challenges for an electronic manufacturing operation.
The Webinar will consist of an educational presentation, discussion of new technologies and techniques, practical how-to advice, and a Q&A opportunity. Specific areas of discussion will include:
PCB pad design Solder paste printing Solder paste selection Component placement Reflow soldering InspectionTo register, please visit www.speedlinetech.com/seminars, or call (508) 541-4749.