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Register Now for the Lead-free Success Stories Webcast
December 31, 1969 |Estimated reading time: Less than a minute
NASHUA, N.H. — SMT, in collaboration with Advanced Packaging and Connector Specifier Magazines, will host a "Lead-free Success Stories" Webcast on February 15, 2006, at 1:00 p.m. EST.
The July 1, 2006, RoHS deadline has the electronics industry buzzing with questions and concerns on successful and reliable lead-free implementations. This live, interactive Webcast will focus on accomplishments and successes with regard to lead-free assembly, packaging, and electronics. This Webcast also will review WEEE success stories.
Speakers for this one-hour event include Ron Lasky, Ph.D., senior technologist, Indium Corporation, and visiting professor at Dartmouth College; Marie S. Cole, senior technical staff member, Lead-free Program Manager, Worldwide Packaging & Test, IBM Technology Group; Peng Su, Ph.D., senior staff engineer, Advanced Packaging and System Integration, Technology Solutions Organization, Freescale; and Peter Biocca, senior market development engineer, Kester.
Previous SMT lead-free Webcasts have averaged 600 attendees. For more information or to register for the "Lead-free Success Stories" Webcast on February 15, 2006, click here. If you are unable to attend, register now to view the archived Webcast after the event.