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Monthly Webinars to Deal With SMT Manufacturing Challenges
December 19, 2005 |Estimated reading time: Less than a minute
FRANKLIN, Mass. — Speedline Technologies experts will address the SMT industry's manufacturing challenges in free, monthly Webinars. Targeted at OEM and CEM process engineers, each Webinar will focus on challenges specific to a major SMT manufacturing process, ranging from lead-free printing to high-speed underfill to practical DOE and SPC for electronics assembly to 0201 and 01005 component assembly.
The Webinars will include an educational presentation, discussion of new technologies and techniques, practical how-to advice and a Q&A opportunity. The 2006 schedule is:
January 19th — Lead-free Printing Process February 16th — 0201 and 01005 Component Assembly Process March 16th — Lead-free Reflow Soldering April 13th — Adhesive Printing May 18th — Pin-in-Paste (Intrusive Reflow) June 15th — Lead-free Wave Soldering July 13th — Challenges of High-speed Underfill August 17th — Lead-free Printing Process September 14th — Practical DOE and SPC for Electronics Assembly October 19th — Cleaning Lead-free Residues November 16th — MicroDot Dispensing December 14th — 0201 and 01005 Component Assembly ProcessAll Webinars will begin at 11:00 a.m. EST. For more information, or to register, please visit www.speedlinetech.com/seminars, or call (508) 541-4749.