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Die Attach Adhesive Self-fillets During Ramp-up
October 26, 2005 |Estimated reading time: Less than a minute
SAN DIEGO — Advanced Applied Adhesives' AAA1002A self-filleting die attach adhesive exhibits capillary flow during a programmed temperature ramp-up. It is said to achieve 100% area coverage under the die without producing a bulky fillet that can overflow onto the top of thin die before it reaches the cure onset temperature.
After AAA1002A is dispensed into an "X" pattern, the die is lowered to a height at which the pattern spreads, but does not reach the edge of the die. Once the part is subject to the standard ramp-up cure process, the material flows, covers the entire die area, and forms a continuous fillet on all four edges. Together with its self-filleting property when ramp-cured, AAA1002A features enhanced adhesion for bottom die attach; bonds to various organic and ceramic substrates; can spot-cure on a heated indexer; can snap-cure in a multi-zone oven; or be batch-processed in a box oven. The material is a low-bleed, Teflon-filled, non-conductive paste for tight-tolerance, single die attach and die-stacking applications. It achieves low-bleed property without sacrificing the properties of the X-BMI resin that passes JEDEC moisture-level testing and 260°C reflow.