-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Kester to Offer Lead-free Assembly Technology Courses
August 12, 2005 |Estimated reading time: 1 minute
DES PLAINES, Ill. — Kester University will host two new courses on RoHS/Lead-free training on August 30–31, 2005, at Kester's Des Plaines, Ill. facility, giving attendees the latest updated information and practical experience to effectively implement RoHS/lead-free assembly. Practical demonstrations of lead-free SMT assembly technology also will give attendees the essential knowledge to transition to lead-free and ensure their products' reliability.
In the August 30th session, attendees will receive classroom instruction on lead-free legislation update; lead-free alloy selection; flux chemistry selection; solderability of lead-free finishes; PCB finishes; component termination finishes and troubleshooting lead-free soldering processes. Classroom instruction will continue from 12:45 until 5:00 p.m., focusing on reliability of lead-free solder joints; lead-free wave assembly; lead-free SMT assembly; inspection criteria; rework with lead-free and material compatibilities. The August 31st session provides attendees with a hands-on application session for lead-free SMT and wave process implementation. Attendees are encouraged to bring their boards/application for a lead-free solution.
The August 30th course fee is $395, and includes a full-day educational course, lead-free assembly technical manual, Lead-free Connection Newsletter, networking opportunities, lunch, beverages and training certificate. August 31st's course fee is an additional $200, and includes a half-day hands-on training within the Des Plaines, Ill. Applications Laboratory. For information on technical content of these seminars, please contact Peter Biocca at (972) 390-1197 or pbiocca@kester.com. For general information, please contact Shirley Wood at (800) 253-7837 or kesteruniversity@kester.com.