-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Seminar Addresses Handheld and Computing Devices Manufacturing
August 8, 2005 |Estimated reading time: Less than a minute
CARLSBAD, Calif. Asymtek and Emerson & Cuming (Billerica, Mass.) will host a seminar for handheld and computing devices manufacturing on August 19, 2005, in Taoyuan, Taiwan. The workshop will address how technology evolutions affect material selection and processing for handheld and computing devices manufacturing. Speakers will focus on lead-free regulations and other factors influencing new processing technologies, such as thermal management solutions and replacing needle dispensing with jet dispensing for throughput requirements.
This free-of-charge seminar will be held from 9:00 a.m. to 4:30 p.m. at the Sunrise Country Club in Taoyuan, Taiwan. For more information, contact Patrick Lee, Asymtek's regional sales manager at 886-2-2902-1860, or via e-mail: plee@asymtek.com; or Andy Yang, Emerson & Cuming's Greater China sales manager at 886-9-3219-2400, or via e-mail: andy.yang@nstarch.com.