-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ECD Now Shipping Thermal Profiler Software
July 5, 2005 |Estimated reading time: Less than a minute
MILWAUKIE, Ore. — ECD has introduced profiling for oven recipes with its Xpert 3 AutoM.O.L.E. software, which works with the SuperM.O.L.E. Gold thermal profiler to automate convection reflow oven process development. Xpert3 distills recipe development into three steps: 1. Create signature; 2. Plan target and 3. Set and verify. The Signature Wizard speeds through the process of creating an oven signature file for a reflow oven at a given convection rate. With oven selection in place, robust target profiles can be planned by choosing from 400 solder-paste formulations in the Xpert3 database. Entering assembly properties information completes the planning stage, and set and verify delivers the oven recipe. Benefits include solder-paste specification with settings of ramp-soak-spike or ramp-to-spike profiles, and the Transpose command immediately converts a profile to a new oven, all reportedly facilitating the lead-free transition.