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DEK to Showcase Mass Imaging Solutions at SEMICON West
June 21, 2005 |Estimated reading time: Less than a minute
FLEMINGTON, N.J. — DEK will exhibit their mass imaging solutions for semiconductor packaging at SEMICON West 2005, to be held July 11-15, 2005, in San Francisco, Calif. A demonstration of the company's backside wafer coating process, which allows high throughput on a cost-effective mass imaging system, and is capable of exceeding the ±12.5 µm Total Thickness Variation (TTV) required by most wafer processing manufacturers, will be shown on DEK's Micron-class Galaxy printer platform for high-accuracy packaging applications.
Additional packaging process applications to be shown include Thermal Interface Material (TIM) imaging and wafer bumping solutions enabled by DEK's ProFlow DirEKt Imaging technology, encapsulation that only requires one print stroke, singulation technology using Virtual Panel Tooling (VPT), repeatable ball placement technology and high-speed substrate bumping. To learn more, please visit DEK at Alphasem's booth, #7111.