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Lead-free Solder Paste Reduces Voiding Defects
May 24, 2005 |Estimated reading time: Less than a minute
CITY of INDUSTRY, Calif. — The Multicore WS300 lead-free solder paste from Henkel Technologies offers print definition with long open and abandon time capabilities. The paste resists humidity and slump and can reduce voiding defects. Other benefits include a lack of visible PCB residue for three days after reflow and slump resistance. Available in lead-free alloys 96SC (SAC387) and 97SC (SAC305), the pastes target fine-pitch, high-speed printing applications.