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Heraeus Acquires Ultra-fine-pitch Solder-powder Technology
May 6, 2005 |Estimated reading time: Less than a minute
WEST CONSHOHOCKEN, Pa. — Heraeus' Circuit Materials Division has acquired the ultra-fine-pitch solder powder technology and business from Potsdam, Germany-based Welco GmbH. With this acquisition, Heraeus is continuing to offer special high-quality materials for the joining technology in the semiconductor and SMT industries.
Continuous miniaturization of electronic assemblies has resulted in greater demand for solder pastes with fine solder powder particles, which can no longer be manufactured economically using conventional methods. By taking over the patented technology and production facilities for the manufacture of ultra-fine-pitch solder powders, both existing Welco and Heraeus customers will benefit from the uninterrupted supply, innovative strength and global technology expertise provided by Heraeus. The product spectrum will be further expanded, enabling customers to develop their own forward-looking new products.