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Universal to Exhibit Placement Platforms at NEPCON East
April 4, 2005 |Estimated reading time: 1 minute
BINGHAMTON, N.Y. — Universal Instruments will be showing two of their AdVantis placement platform models at the NEPCON East show, to be held May 3-5 in Boston, at booth #3001. The AdVantis AC-30L model, a high-speed modular system featuring Universal's Lightning head, and the AX-72 model—a modular, multi-function system featuring a choice of placement and dispense head options along with odd-form placement capability, are the two machines to be shown.
Universal will be demonstrating the AdVantis platform's flexibility in New Product Introduction (NPI) applications and fast product changeovers ideal for high-mix manufacturing environments. Experts from Universal's Binghamton SM Lab and Global Services teams will also be at the booth.
The AC-30L platform combines the throughput of Universal's rotary Lightning head with the flexibility and performance of the AdVantis platform. It delivers high utilization for both top- and bottom-side applications, along with high-speed placement of large parts. The Lightning head itself features a radial array of 30 modular, individually controlled spindles, reportedly driving placement rates up to 30,000 cph. It addresses components from 01005 to 30 x 30 mm, and places devices such as CSP, WSP, uBGA and Melfs at full speed.
The multi-function AX-72 platform's configuration deploys up to two heads on a single beam, offering combination head capability. Components range from 0201s to 55-mm² devices at placement rates up to 16,500 cph. It offers a selection of camera systems and feeder types, including tape, tray, tube, component strips, bulk, odd-form, wafer, waffle and gel pack. The AX-72 also delivers material dispensing capabilities.