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2004 International Wafer-Level Packaging Congress Announces Best Paper
December 8, 2004 |Estimated reading time: 1 minute
Minneapolis, Minn. — Speakers at the first International Wafer-Level Packaging Congress (IWLPC), held October 10-12, 2004, in San Jose, Calif., addressed leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging. As rated by the attendees, the Best Paper Award was presented to Dr. Udo E. Frank of FEINFOCUS GmbH (Garbsen, Germany).
In his paper, entitled "Detecting and Analyzing Wafer Bump Voids with X-ray Inspection," Frank discusses X-ray imaging technology that can detect and measure voids within solder bumps on chips and determine the viability of the component, based on pre-set threshold values. In this way, the X-ray inspection system converts 3-D voids to measurable 2-D images, enabling the system to calculate the ratio of the size of the void(s) within a solder bump to the total mass of the ball. The system can also determine the largest linear distance between two points in the void and compare the result with the diameter of the ball.
Frank's paper is featured in the 2004 IWLPC Proceedings, available in the SMTA Bookstore and soon-to-be online in the Knowledge Base at www.smta.org. For more information on the 2005 International Wafer-Level Packaging Congress, to be held November 3-4, contact Kristin Nafstad at (952) 920-7682 or kristin@smta.org. Details regarding the 2005 IWLPC can be found on the event Website at www.smta.org/iwlpc.