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SMT/HYBRID/PACKAGING 2005 Issues Call for Tutorials
September 2, 2004 |Estimated reading time: 1 minute
Stuttgart, Germany — The Call for Tutorials for SMT/HYBRID/PACKAGING 2005, taking place April 19 through 25, 2005, in Nuremberg, Germany has been published.
Conference and tutorials support the industry in the search for innovative solutions for cost-effective, competitive and reliable microelectronics production. The core focus of the 2005 conference is a full-day session on "Flex Printed Circuit Boards — Innovation with Added Value for the Assembly." Building on the success of last year's 24 practice-oriented half-day tutorials is planned alongside the technical sessions.
The international program committee, led by Professor Herbert Reichl of the Fraunhofer Institute of Reliability and Microintegration, Berlin, invites all sector specialists, from designers to users to submit tutorial proposals. The half-day tutorials (three hours) will be training courses on topical issues concerning microelectronics assembly. They will have a strong practical significance. In particular, tutorials on lead-free assembly and those addressing the automotive sector are being sought.
Tutorials are being sought from these general topics:
- Vertical system integration on PCBs: Active and passive components, new functions
- Packaging of electronic components: Electrical/optical, from wafer-level to module packaging
- Electronic assembly design: High speed, high data rate, embedded elements, thermal management
- Assembly of electronic components: Active and passive components, electrical/optical
- Electronic assembly interconnection technologies: Adhesives, soldering — lead-free/high-temperature, bonding, mechanical interconnection technologies
- Electronic assembly process technologies: Batch, in-line, reel-to-reel
- Electronic assembly diagnostics and quality assurance
- Technical reliability of electronic assembly: Prognostics based on thermomechanical analysis
- Advanced materials: Materials flex, rigid and substrates for system integration
- Sustainability
Tutorial proposals should be submitted in English or German by October 8, 2004. The Call for Tutorials with detailed information on the submission requirements, as well as the latest news on the exhibition are available at www.smt-exhibition.com.