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Growing Adoption of Lead-free Electronic Assemblies Challenged by Materials and Process Considerations, Says Frost & Sullivan
August 16, 2004 |Estimated reading time: 1 minute
Palo Alto, Calif. — New analysis from Frost & Sullivan, "World Surface Mount Technology (SMT) Roadmap," reveals that lead-free solder paste consumption is the highest in Japan, with consumer electronics being the most notable driver for the adoption.
Efficient temperature control is of crucial importance. Unless the thermal efficiency and profiles of the products being processed are improved, problems posed by high temperature are likely to continue to restrain market growth. High processing temperature requires 15 to 25 percent more energy, making electronic assemblies increasingly prone to warping and board-drop issues.
Solder alloys comprising SnAgCu have been proven efficient, but manufacturers are uncertain if these are capable of offering long-term reliability. In a bid to solve some of the problems associated with lead-free solder paste, SMT soldering equipment manufacturers are trying to invest extensively in product development.
"World Surface Mount Technology (SMT) Roadmap," part of the Surface Mount Technology Subscription, evaluates the current and future prospects of lead-free electronics assemblies in the electronics industry that includes SMT equipment suppliers, manufacturers of printed circuit board assemblies (PCBAs) and solder paste, and suppliers of electronics components and advanced electronics packaging. It provides insight into the drivers and restraints influencing the market, as well as detailed competitive information to enable companies to boost market share.
Frost & Sullivan, an international growth consultancy, has been supporting clients' expansion for more than four decades. For more information, visit electronics.frost.com.