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Dow Corning, IMEC to President Joint Paper at ECTC
May 14, 2004 |Estimated reading time: 1 minute
Midland, Mich. and Belgium — Dow Corning Corp. and Belgium's Interuniversity MicroElectronics Center (IMEC) will present a technical paper on wafer-level packaging during the 54th Electronic Components and Technology Conference (ECTC) held next month in Las Vegas, Nev.
The paper addresses Integration of Low-Stress Photopatternable Silicones into Wafer-Level Packaging and will present a novel wafer-level package concept based on a silicone-under-the-bump (SUB) design. Incorporating a new elastomeric spin-on silicone pad material and standard processing steps, the new design promises significant improvements in reliability and stress relief for wafer-level packages.
- WHO: Geoff Gardner, electronics development specialist and lead author from Dow Corning
- WHAT: Joint paper presentation on wafer-level packaging at 54th ECTC
- WHEN: Wednesday, June 2, 2004; 8 to 11:40 a.m.: Session 4: Adhesives and Encapsulants
- WHERE: Caesars Palace, Las Vegas, Nev.
The premier international packaging, components and microelectronic systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer attendees an outstanding array of packaging technology information. This year's conference will have 38 technical sessions, 14 professional development courses, a panel discussion, a plenary session and a technology corner with more than 50 exhibitors.
Dow Corning Corp. is a globally integrated provider of materials, application technology and services, and is focused on providing innovative technology for all segments of the electronics industry. For more information, visit www.dowcorning.com/electronics.