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IPCWorks 2004 Technical Conference Focuses on Design, Flex and Chips, Packing and Storage
May 10, 2004 |Estimated reading time: 1 minute
Northbrook, Ill. — IPC — Association Connecting Electronics Industries announces a call for papers for its IPCWorks 2004 technical conference, which takes place October 28, 2004, at the Minneapolis Convention Center in Minneapolis, Minn.
This year's technical conference will specifically focus on PCB design, flex and chips, and packing and storage.
In the design track, the critical issues, including high-speed circuits, embedded passives, optical materials in organic substrates and RF design parameters, that face today's designer in the creation of electronic and optoelectronic assembly products will be examined.
Both the combined applications and the independent properties of flexible circuitry and chip scale packaging will be explored in the second track, while the packing and storage track will concentrate on the need for an industry standard on proper packaging and preservation of PCBs and board assemblies.
Presently, IPC is seeking papers from the following suggested topics:
Design:
- Design for EMC
- Embedded passive component technology
- Design for optimum manufacturability
- Radio frequency design principles
- Designing to facilitate test and reliability
- High-speed applications using today's materials
- Impedance control characteristics made easy
- Establishing signal integrity requirements
- From prototype to full production without losing capability
Flex and Chips:
- Wafer level CSP
- Flex processing innovations
- CSPs in three dimensions
- CSP solder joint reliability
- Flex and lead-free
- Flex and CSP materials
- Flip chip development
- Flex test and reliability
- Design for CSPs on flex
Packing and Storage:
- Packaging methodologies (vacuum bags, dry nitrogen, desiccant, moisture indicator cards)
- Mechanical handling damage
- Baking/PCB moisture levels prior to soldering
- End user storage/shelf-life requirements
- Solderability/oxidation concerns
- Laminate concerns (delamination)
- Effect of no-clean processes on board storage
Paper presentations should be 30 to 45 minutes in length, non-commercial in nature and focus on technology rather than a company's product. Previously published papers and papers deemed commercial by the Technical Program Committee are not acceptable.
Abstracts that detail case histories, field data, new technologies/innovations, or research and findings and summarize the problems and resolutions, methods used, results of experiments, and benefits to the industry must be received by June 15, 2004. Each 200- to 300-word abstract should include a biography. If an abstract is selected, technical papers and visuals will be due on September 15, 2004.
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,200 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.