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43 Members Honored at IPC Annual Meeting
October 15, 2003 |Estimated reading time: 4 minutes
Northbrook, Ill. — IPC — Association Connecting Electronics Industries honored 43 members at the 2003 IPC Annual Meeting, held September 28 through October 2 in Minneapolis, Minn., for their contributions to IPC and the electronics interconnect industry.
The following seven individuals received IPC President's Awards, which are given to members who have exhibited ongoing leadership in IPC and have made significant contributions to the association and the electronics interconnect industry:
- Michael Carano, Electrochemicals Inc., for his leadership in the IPC Long-Range Strategic Planning meetings, with the IPC Printed Circuits Expo technical program and on the Printed Circuit Board (PCB) Suppliers Council.
- S. Michael Buscher, Assembléon America Inc., for his leadership in the IPC SMEMA Council, IPC Government Relations Committee and IPC SMEMA management meetings and the IPC Long-Range Strategic Planning meetings
- Nilesh S. Naik, Eagle Circuits, for his leadership in the Interconnect Manufacturing Services (IMS)/PCB Presidents Council, IPC Designers Council and IPC Long-Range Strategic Planning meetings
- J. Philip Plonski, Prismark Partners, for his leadership on the Technology Market Research Council (TMRC) and World Market committee
- Peter Palmer, Cookson Electronics, for founding and leading the IPC Solder Products Value Council
- Karl F. Seelig, AIM Inc., for chairing the Lead-free Solder Round Robin Test Program
- Lionel Fullwood, WKK Distribution Ltd., for his leadership in the IPC Rigid Printed Board Design, HDI Design and Rigid Printed Board Performance Task Groups
Three Special Recognition Awards were presented to individuals who have made recent exceptional contributions to an IPC program. Vern Solberg, Tessera Inc., was awarded for his numerous contributions toward the release of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard, the forthcoming successor to the IPC-SM-782A. Frank Cala, Church & Dwight Co. Inc., was awarded and made a lifetime member of the TAEC for his five years of leadership on the IPC Cleaning and Coating Committee. Additionally, Gerard A. O'Brien, Photocircuits Corp., was honored for his constant willingness to participate in and numerous contributions toward the 4-14 Plating Processes Subcommittee and the 3-11g Metal Finishes Data Acquisition Task Group.
IPC also presented 33 Distinguished Committee Service Awards at the 2003 IPC Annual Meeting. This award is given to IPC committee members who have made an exceptional contribution to a specific standard, guideline, round robin test program or other IPC program. The following individuals were awarded for their significant efforts in the release of IPC-6013A, Qualification and Performance Specification for Flexible Printed Boards:
- Nick Koop, Minco Products Inc.
- Lawrence C. Dexter, Advanced Circuit Technology
- Russell S. Griffith, Parlex Corp.
- William A. Ortloff, Sr. , B/C Engineering
- Ted Edwards, Dynaco Corp.
- Clark F. Webster, All Flex Inc.
- Michael Beauchesne, Advanced Circuit Technology
- Thomas F. Gardeski, E. I. du Pont de Nemours and Co.
For their support in the development of IPC-1050, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, the following eight members were also awarded the IPC Distinguished Committee Service Award:
- Pete Gilmore, Amelex
- Sheila Akins, M-Flex USA
- Jim Jenkins, Harris Corp.
- Michael R. Green, Lockheed Martin Space Systems
- Akikazu Shibata, JPCA
- Gerald Wooten, Lockheed Martin Aeronautics Co.
- Alan Cash, Northrop Grumman
- George T. Kotecki, Northrop Grumman
- Mel Parrish, Soldering Technology International
IPC also honored the following six members for their significant efforts in the release of IPC-WP/TR-584, IPC White Paper and Technical Report on Halogen-Free Materials Used for Printed Circuit Boards and Assemblies:
- Douglas J. Sober, Bakelite Epoxy Polymers Corp.
- Paul F. Ranken, Ph.D., Albemarle Corp.
- James F. Maguire, Intel Corp.
- David A. Vaughan, Taiyo America Inc.
- Ceferino G. Gonzalez, E. I. du Pont de Nemours and Co
- Daniel K. Pannell, Ph.D., Great Lakes Chemical Corp.
The following individuals were also awarded Distinguished Committee Service Awards for their efforts in the release of IPC-8413-1, Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing:
- Daniel Nelson, Ph.D., DGN Consulting
- Edward Agranat, Newport Corp.
- Mike Edwards, Pensar Inc.
- Alain Giraud, Nextrom Services SA
- Randy Heyler, Newport Corp.
For their support in the development of IPC-5701, Users Guidelines for Cleanliness of Unpopulated Printed Boards, Doug Pauls, Rockwell Collins, and Philip W. Wittmer, Delphi Delco Electronics Systems, were also awarded Distinguished Committee Service Awards.
Finally, the following four additional members were honored for their individual work on various programs:
- Arthur C. Rutledge, Jr., Fawn Electronics Co., for chairing the IPC-D-326A Task Group
- Byron Case, L-3 Communications, for his work toward the release of IPC-2251, Design Guide for the Packaging of High Speed Electronic Circuits
- Gene H. Weiner, Weiner & Associates Inc., for chairing and establishing the PCB Suppliers Leadership meeting
- James J. Hickman, Hickman Associates Inc. and Quantum Performance Group LLC, for chairing the Suppliers Council Steering Committee's new Technology Subcommittee
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,200 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.