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News
December 31, 1969 |Estimated reading time: 20 minutes
Compiled by SMT Staff
Mexitrónica 2003: Gathering Place for the Mexican Electronics Industry
GUADALAJARA, Jalisco, Mexico — The Mexitrónica Expo 2003 features a full spectrum of products and services fueling Mexico's electronics manufacturing sector. Held Tuesday, October 21 through Thursday October 23, at Expo Guadalajara, the exhibition and conference is designed for suppliers interested in developing or expanding their sales in Mexico, as well as the convergence of business interests and industry influence. This comes together for a one-of-a-kind opportunity to engage key players in this dynamic marketplace.
Mexitrónica 2003 will be held in conjunction with EnsamblaMex and Tecnocalidad, the event for the QC/QA professional — all part of Mexico's Annual International Manufacturing Technology Week. Show hours will be as follows: October 21 and 22: from 3:30 to 9 p.m.; October 23: 3:30 to 8 p.m. There also will be a free networking party on October 21.
Offering suppliers of tools, equipment, components and materials a direct connection to the individuals who operate Mexico's electronics manufacturing facilities, the show is known as the gathering place for the Mexican electronics industry. Industry suppliers worldwide recognize this as a great opportunity to connect with customers and prospects in Mexico.
In 2002, more than 8,000 qualified attendees and 400+ exhibitors filled the convention center. Additionally, more than 75 percent of attendees are involved in the purchasing decisions of their companies.
Besides a significant showing in exhibits, Mexitrónica 2003 offers a comprehensive conference schedule. For staff training and career advancement, the technical program offers a wealth of information, from the basics of workmanship to the latest advances in high-quality, high-yield manufacturing of circuits and assemblies. All sessions reflect the best thinking and practices used by the world's leading manufacturers.
Last year, Mexitrónica presented more than 20 seminars on the latest information in the electronics industry. This year, the conferences' multi-faceted program will feature three days of leading-edge seminars and workshops offered in both English and Spanish.
For complete Mexitrónica 2003 coverage, including a list of exhibitors and detailed conference information, visit SMT Magazine's Web site at www.smtmag.com.
Data I/O Launches Chinese Web Site
REDMOND, Wash. — Data I/O Corp. has launched a Chinese language Web site in Simplified Chinese to provide a higher level of customer service and technical support in China and other Asian markets.
The Web site creates an alternative language delivery system for product information and specifications, news, company information, contact information, and requests for technical support, product sales and feedback.
The company's support in Chinese also includes offices in Hong Kong, Shanghai, Shenzhen, and a workforce that includes Chinese-speaking engineers and managers in sales, service and engineering design. Data I/O's worldwide sales and customer support network includes 11 locations in Asia. The Chinese Web site expands the company's multilingual network to four sites in English, German, Japanese and Chinese.
Recent projections put Chinese electronics production at $80 billion by 2005, larger than the estimated $73 billion production in all of Western Europe, according to a study from International Finance Corp. (IFC).
PCB BOOK-TO-BILL RATIO
June Book-to-Bill Increases Over May Numbers
NORTHBROOK, Ill. — The IPC PCB book-to-bill ratio for June was 1.02, meaning $102 worth of orders for new boards were received for every $100 billed (shipped). The ratio increased from the May level of 1.00. Sales billed (shipments) in June 2003 decreased 22.3 percent from June 2002, and orders booked decreased 12.5 percent from June 2002. Compared to 2002, PCB bookings are down 19.7 percent YTD, while PCB shipments are down 24.8 percent YTD.
June's book-to-bill level increased from May's numbers, while orders booked for June 2003 decreased 12.5 percent below the level in June 2002.
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Q & A: design for manufacturing
Q: What are the advantages of a Design for Manufacturing (DFM) environment and automating the process to ensure high-yield volume manufacturing?
A: When implemented appropriately, DFM can make any company more competitive. By considering manufacturing issues during the design phase, significant issues can be resolved early, and key advantages realized. The most rewarding benefits include improved product development, a significant decrease in development time, and overall production costs. All of these factors will make you a much more competitive player in today's marketplace and accelerate time-to-market.
Product development is a key influencing factor in the manufacturing process. In general, the product design can determine as much as 80 percent of the costs, as well as significantly impacting the quality, reliability and serviceability of products. By considering manufacturing issues during the design process, development time is decreased and the transition into manufacturing is much easier.
Companies also can see improved assembly yields, a decrease in manufacturing rejects, and a reduction in engineering changes in the production phase. Today's most successful manufacturers recognize the urgency of getting quality products to market as quickly as possible, which can be extremely costly. However, in a DFM environment all phases of engineering are in close communication from the onset.
Engent has provided DFM services for a number of NPI efforts, leading to a successful transition of products into volume manufacturing. The process of understanding these manufacturing issues has been made more robust through the use of software packages that incorporate these manufacturing rules into the analysis. To accomplish a robust DFM, tens of thousands, and in some cases hundreds of thousands of rule checks must be performed, a process that lends itself to software automation. The bugs are worked out early, and the transition from design to manufacturing can be simple and painless. Ramping up new projects and producing the necessary volumes quickly becomes a less risky undertaking in a DFM environment.
Daniel F. Baldwin is the president of Engent Inc., Norcross, Ga.
Cookson Electronics Announces Portfolio Restructuring
FOXBORO, Mass. — As part of a wide restructuring plan, Cookson Electronics, a division of Cookson Group plc, is exiting and selling its equipment business.
This decision will not affect their materials businesses: Alpha Metals, Fry, Enthone, Polyclad Laminates and SCS (Specialty Coating Systems). The decision relates to Speedline Technologies and its product lines: MPM, Camalot, Electrovert and Accel.
The company states that the intensity of recent cycles and variability in the equipment marketplace has led it to sell this business and focus its resources on the core business of developing and producing advanced materials for both the electronics and surface finishing industries.
Siemens Names Top Management
MUNICH, GERMANY — Johann Löttner has been named CEO of Siemens Dematic AG by the Supervisory Board. He was promoted from chief financial officer of Siemens VDO Automotive AG.
Johann Löttner
Löttner takes the place of Dietmar Straub, Ph.D., former CEO who successfully completed the integration of Mannesmann Dematic AG — acquired with Atecs — into the Siemens Production and Logistics Systems Group.
Löttner served in various positions at the Mannesmann company since 1975, ending as deputy chairman of the Managing Board of Mannesmann VDO AG. When Siemens VDO Automotive AG was established in May 2001, he was appointed CFO.
Additionally, Tilo Brandis has been appointed president of the Electronics Assembly Systems Division (EAS) of Siemens Dematic AG. He succeeds Gerhard Ott, who has taken over other tasks within the company.
Brandis worked for Siemens for six years in various management positions, and believes that with the potential derived from the division's highly qualified employees, the company is well equipped for the future.
APG Named ASSET Partner Provider
LONGMONT, Colo. and RICHARDSON, Texas — APG Test Consultants Inc. joined the Partner Provider Program of Ensure DFT (EDFT) Services, the design-for-test division of ASSET InterTech Inc.
The Partner Provider program helps electronics manufacturers effectively deploy boundary scan and accelerate the migration of boundary scan from a manufacturer's design group to volume manufacturing. The EDFT Partner Provider program combines EDFT's expertise in test strategies and implementation techniques with third parties that have extensive experience in boundary scan, in-circuit test (ICT) and other electronics test techniques.
A.P.E. Completes J-STD Certification
KEY LARGO, Fla. — A.P.E. South, a supplier of rework equipment to the global electronics manufacturing marketplace, completed the Joint Industry Standard Instructor Course (IPC/EIA J-STD-001C). Completed by all field service engineers (FSEs) and regional sales managers, the J-STD-001C course was instructed by Master Instructor Ray Dawson from Team Source in Austin, Texas, and was held at A.P.E.'s corporate retreat in Key Largo, Fla.
(L-R): Casey Scheu, Cathy Patterson, David Horvath, Patrick McBride.
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The following individuals completed the J-STD-001C course in February: Cathy Patterson (national sales manager), Casey Scheu (vice president), Patrick McBride (regional FSE director), David Horvath (Eastern regional sales manager), Justin Bentley (Midwest FSE), Neil Curtis (Midwest regional sales manager), Ike Sedberry (Midwest FSE), Maurice Vaughn (tech support), and Lynn Carpenter (senior FSE).
Universal Opens Facility to Showcase New Products
BINGHAMTON, N.Y. — At a press conference here in June, Universal Instruments Corp. opened the doors of its enhanced production facility to give a look at the company and present its technology development roadmap, as well as its product and support strategies.
While the company has committed to China, with investments including a technical center in Suzhou and a new manufacturing plant in Shekou as well as a strategic support center in Hong Kong, these ventures extend its global reach by augmenting its U.S. operations. Though the U.S. may be seeing the end of the recession, it has been nonexistent in Asia, the company added. In the same vein, Universal plans to set up shop in India to broaden its base and take advantage of the subcontinent's prowess in software development.
Universal still remains strongly committed to markets in the U.S. "We want to remove the perception that Universal is 'going out of business' or 'moving to China,'" explained Gene Heiser, vice president of sales & service at Universal.
To that end, Universal showcased seven new products and gave a comprehensive overview of its Surface Mount Laboratory. The products include:
- GSM Genesis Platform. The key to this surface mount placement product is that it uses interchangeable parts, as well as proprietary VRM linear motor technology.
- Genesis Lightning. This is the Genesis with Universal's new turret head.
- AdVantis. Universal's new entry into the mid-range placement market.
- HSP. The 4797 HSP chipshooter won the 2002 SMT VISION Award in the Pick-and-Place category.
- Polaris. The Polaris multi-process assembly cell automates end-of-line and light mechanical assembly processes.
- Dimensions Software Suite. The software integrates factory-wide manufacture, business systems and external systems.
Indium Engineers Earn SMTA Certification
CLINTON, N.Y. — Three of Indium Corp.'s technical support engineers have attained SMTA Certification for the SMT Process.
Karl Pfluke, who has worked in the materials industry for nine years and has a Certification in powder metallurgy; Tim Jensen, who has spent five years in the SMT materials field and has a BS in chemical engineering; and David Sbiroli, who has more than 10 years of experience in the areas of SMT and electrical interconnect materials and has a BS in mechanical engineering all have earned the title of Certified Process Engineer.
CAPTION: (L-R) Karl Pfluke, Dave Sbiroli and Tim Jensen.
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The Surface Mount Technology Association (SMTA) recently introduced the Certification Program, which they believe will become one of the electronics assembly industry's most respected qualifications. Two independent certification programs and exams are offered — one for the SMT process and the other for SMT systems.
YESTech, Aegis Enter Partnership
SAN CLEMENTE, Calif. —YESTech entered into a strategic partnership with Aegis Industrial Software wherein YESTech will adapt Aegis' CircuitCAM software for CAD, Gerber, ASCII/Centroid and other file conversion for auto-training YESTech's X-ray and optical inspection systems.
CircuitCAM will transform more than 32 different design data formats into the standard YESTech machine format, providing automatic machine training. This delivers new product introductions (NPI) and engineering changes while eliminating manual processes traditionally required with other computer-integrated manufacturing (CIM) software products.
The software also offers YESTech customers bills of materials management, separation of through-hole and surface mount components, and optional program generation for many other types of production machinery.
World Market for Screen Printer Equipment Shows Signs of Recovery
FOREST HILLS, N.Y. — The world market for screen printer equipment has begun to see recovery in 2003, driven mostly by electronics manufacturing in Asia, according to the report "Screen Printer Equipment: World Markets, Drivers and End-Users — 2003-2008 Analysis and Forecasts," published by Dedalus Consulting Inc.
In 2003, the world market for screen printers will reach more than $147.7 million, with automatic units making up more than 63 percent of total world market demand. The average selling price of an automatic unit was approximately $115,000 in 2002, and pricing is expected to remain stable through 2003. Semi-automatic units made up approximately 28 percent of total world demand, with manual types comprising the remaining 9 percent.
The U.S. market, which led the industry in production and demand several years ago, has given way to the Asian market, which now makes up more than 38 percent of total consumption. However, after two and a half years of decline, the report forecasts that the U.S. market will grow by 7 percent in market value in 2003. An additional high-growth market is Eastern Europe, which showed a robust growth rate of 17 percent through 2002 and will continue growing strongly over the next five years.
Factors affecting growth include the introduction of new products and technology, such as advanced technology packages and flip chip technology in fabricating processor packages. These introductions have increased the need for pick-and-place machines in back-end semiconductor packaging.
ACI and phoenix|x-ray Align for Analysis
PHILADELPHIA — phoenix|x-ray Systems + Services Inc. and the American Competitiveness Institute (ACI) have formed a cooperative agreement under which phoenix was invited to work with the ACI. The partnership gives phoenix the opportunity to access ACI's knowledge base and network, and in exchange widens the potential for nondestructive testing of electronic components and assemblies at ACI.
phoenix|x-ray's East Coast demonstration site is at the ACI, as well as pcba|analyser with oblique view at high magnification (OVHM) and dual|mode (nano and micro focus) tube.
DEK Opens New Process Support Laboratory in Suzhou
FLEMINGTON, N.J. — DEK is expanding its presence in China with the opening of a new process characterization laboratory in Suzhou, Jiangsu Province.
The new 500 sq m DEK Process Support Products (PSP) lab mirrors DEK process activities already operating in other parts of the world and is a direct response to the needs of its customers. Feedback from applications and process engineers in the field over the last few years showed that DEK's customers needed to know that they were achieving the best possible performance from their equipment and processes.
Further commitment to the delivery of a complete and optimized process is demonstrated by the opening of DEK's newest laser stencil manufacturing facility, also in Suzhou. This latest addition to DEK's global stencil business provides its growing Chinese customer base with immediate availability of state-of-the-art stencil technology, and complements the process development and applications engineering lab's ability to develop and deliver locally optimized process solutions.
In other company news, DEK has seen sales figures from its Asia-Pacific, European and American businesses showing month-on-month growth in unit sales for the first half of 2003, and promising improvements in a market that has been plagued by sagging economics and gross overcapacity for an unprecedented period of time.
EMS News
Mil/Aero Contract Manufacturers Face Hurdles, Opportunities, Says TFI
ALAMEDA, Calif. — At the June 9 Quarterly Forum for Electronics Manufacturing, Outsourcing and Supply Chain event, Technology Forecasters Inc. (TFI) released a study detailing special challenges experienced by military and aerospace electronics manufacturers, and how outsourcing manufacturing is presenting new advantages.
TFI projects global revenues for aerospace/defense electronics contract manufacturing (CM) to grow from $4.0 billion in 2001 to $7.7 billion in 2006, for an average annual growth rate of 14.0 percent. During this period, the forecaster predicts manufacturing-outsourcing market penetration of aerospace/defense will increase from 11 percent to 16 percent.
For the study, TFI interviewed aerospace/defense contractors and electronics CMs to gain insight into the market. Regarding new decisions being made by aerospace/defense contractors, price is becoming more of an issue in new decisions by aerospace/defense contractors, and that low-cost international competition is increasing, the study found.
Sanmina PCB Plant Certified
SAN JOSE, Calif. — Sanmina-SCI Corp., a global CEM and high-performance PCB fabricator, announced that its PCB plant in Wilmington, Mass., has completed certification and qualification assessment by the Defense Supply Center (DSCC), Columbus, Ohio.
The facility meets all requirements necessary for certification to MIL-PRF-31032 and also has obtained qualification for military specification MIL-PRF-31032/1A and /2 for Type 3, GF and GI. This allows the company's technology and volume capabilities to be accessed by defense and aerospace customers.
The DSCC is the largest supplier of weapon systems spare parts and end items for the Department of Defense (DoD). To be certified, products must be manufactured in the United States and pass stringent laboratory analysis. Specific product characteristics are published by DSCC in its Quality Manufacturers List (QML).
NEWSMAKERS
People Karen Olson
Glen Rock, Pa.-based Adhesives Research Inc. promoted Karen Olson to president and CEO. Olson succeeds Edward L. Daisey, who retired from the company after eight years. Olson has been with the company in various positions since 1992.
Bill Marca will assume the newly created position of industry segment account manager for the automotive industry for Universal Instruments, Binghamton, N.Y. Within the new position, Marca will be responsible for defining market size and potential within a specific industry segment as well as working in conjunction with regional sales teams to support target accounts. Additionally, Bob Lamanna has been appointed director of global services. Lamanna's responsibilities will include increasing the company's market share, improving profitability and enhancing customer satisfaction.
Robert Sweeney has been named managing director for Southeast Asia and Japan by GE Global Electronic Solutions (GES), San Diego, Calif. In his new role, Sweeney will lead the company in driving expansion in these regions. He will spend half his time in San Diego, and the rest working directly from company offices in Tokyo, Singapore, Shanghai and Taipei.
Erik Bergum has been appointed vice president of sales for Polyclad Europe by Cookson Electronics PWB Materials & Chemistry, Londonderry, N.H. Bergum will be responsible for growing the sales and directing the technical service of the company's high-performance laminates, prepegs and resin-coated foils used in PWB and electronic packaging industries.
Daniel Tan
Weymouth, Dorset, United Kingdom-based DEK appointed Daniel Tan as branch manager of its recently opened Memphis, Tenn. stencil design and manufacturing facility. Tan is an experienced manager of design, manufacturing and logistics for precision stencils, having previously worked at Acumen Technologies in Northern California. His move to Memphis follows DEK's acquisition of Acumen in 2002.
Companies
EKRA GmbH, Bönnigheim, Germany, and Speedline Technologies Inc., Franklin, Mass., announced an agreement to cross-license patented technologies relating to screen and stencil printing technology. The focus of the agreement involves vision alignment technology from Cookson and post-print inspection technology from EKRA. Additionally, the companies announced they have amicably resolved all pending patent disputes between them.
Tamura Kaken Corp. opened a solder paste and flux blending manufacturing facility in Stockton, Calif. Under a joint agreement with Cookson Electronics Assembly Materials, the company will have local manufacturing and a source of supply to the solder market. Additionally, the company opened a product support office in San Jose, Calif.
BRIEFS
Milara Appoints Representative
Milara Inc. appointed Kirby and Demarest as a manufacturer's representative serving Oregon, Washington, Idaho, Montana and the Province of British Columbia. With sales offices in Portland, Ore., and La Connor, Wash., Kirby and Demarest is known as a representative and distributor for electronics assembly and will represent Milara's full line of stencil printers for SMT and wafer applications.
Zestron Screening Capabilities
For the past 10 years, Zestron has screened solder paste, fluxes and adhesives from major manufacturers in their technical centers to determine their removability characteristics with the company's core product range. All screenings are conducted on standardized equipment available in today's market. To date, Zestron has tested more than 60 adhesives, 350 solder pastes (soldered), 300 solder pastes (not soldered) and 200 fluxes. Each cleaned part must pass stringent internal examination and evaluation tests to achieve a "+" rating.
ets Launches Web Site
Electro-Tech Systems Inc. (ets) introduced a redesigned Web site to reflect the company's growth. The goal of the redesign was to produce a site that loads quickly, is easy to navigate, provides a searchable data base, allows information to be downloaded, allows users to contact the company and is visually pleasing. Located at www.electrotechsystems.com, the site's additional features include a product search with detailed information on environment control, and ESD testing and consulting services as well as a FAQ section covering ESD test and measuring equipment, environmental control, calibration and repair, and more.
DEK Highlights New Web Section
DEK added a new section to its Web site that consolidates information on the benefits of using PumpPrint process technology for high-speed adhesive deposition. The section may be accessed from the home page, www.dek.com. The updated site includes material on the pump technology as well as technical articles, case studies and customer support. Additionally, users may register to access a detailed process information section.
GPD Global, Partech Align
GPD Global has aligned with Partech Corp., a Korean-based distribution company. Under the agreement, Partech will provide customer support in the electronics assembly and high-density interconnect industries. Partech has served the electronics and semiconductor industries since 1988, and their client list includes Exair Corp. and Dymax Corp., among others.
BTU Announces Web Site
BTU International introduced a new company Web site designed to be a product and process resource for customers. Located at www.btu.com, the site includes the company's solutions for key thermal processing applications such as semiconductor packaging, surface mount and advanced materials. Links to the product pages lead to a virtual "product tour," downloadable brochures and requests for price quotes. Additional content includes company background and news, plus investor pages featuring stock quotes, SEC filings, financial disclosure press releases and annual reports.
ENVIRONMENAL UPDATE
Kyzen Collaborates on NPL Project
NASHVILLE and TEDDINGTON, MIDDLESEX, UK — Kyzen Corp. is collaborating with the National Physical Laboratory (NPL) on a project investigating the flux cleaning efficiency in lead-free soldering processes.
The project's objective is to answer three key questions: Is there a problem cleaning flux residues from lead-free pastes?; Do cleaning regimes need to be changed?; and Can NPL help benchmark cleaning performance for lead-free processes? The project will investigate the cleaning of lead-free solder pastes by different cleaning equipment and chemistries, which is where Kyzen's input will be used.
In the first phase, the focus will be on determining the reflow profile that begins to affect the ability to clean. Once a suitable range of profile conditions has been established, the second phase will investigate the cleaning efficiency for the complete range of component types, cleaning regimes, two paste types and three profile conditions.
The project should be completed in a year. This time frame includes planning, sourcing and dissemination activities.
ASSOCIATION NEWS
IPC Releases Three Assembly Documents
NORTHBROOK, Ill. — IPC — Association Connecting Electronics Industries released a conformal coating standard and two guideline handbooks that assist in conformal coating application and electronics assembly requirement implementation.
- IPC-CC-830B, Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies, is the industry standard for qualification and quality conformance of conformal coating. This 18-page, updated document outlines ways to obtain maximum information with minimum test redundancy and includes requirements and evaluations of material properties using standardized test vehicles. Many companies use IPC-CC-830B as a replacement for the deactivated MIL-I-46058 conformal coating standard.
- IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings, picks up where IPC-CC-830B leaves off. This 88-page handbook is a compilation of the conformal coating industry's practical experience. It provides designers and conformal coating users with an understanding of the properties, uses and applications of various conformal coatings.
- IPC-HDBK-610, Handbook and Guide to IPC-A-610 (Includes IPC-A-610-B to C Comparison), offers explanatory and tutorial information about the implementation of the electronics assembly requirements in IPC-A-610C. This 115-page handbook includes five appendices with a comprehensive comparison of the changes between versions B and C of IPC-A-610, an explanation of minimum electrical clearance, metric conversion, the U.S. Department of Defense Adoption Notice, and Amendment 1 to IPC-A-610C.
SMTA Announces Hutchins Grant Recipient
MINNEAPOLIS — The SMTA has announced the recipient of the 2003 Charles Hutchins Educational Grant. Andrew Perkins from Georgia Institute of Technology, Atlanta, has been selected by the SMTA Grant Committee to receive the award for his project titled, "Investigating the Combination of High and Low Cycle Fatigue on Solder Joints."
Perkins is a graduate student in the field of mechanical engineering. Recently, his experience has been in material characterization, numerical modeling, design and reliability.
Perkins' project was selected from 17 applications reviewed by SMTA members and industry educators. The award, which was established in memory of past SMTA president and industry colleague Charles Hutchins, who died in 1997, includes $5,000 and travel expenses to SMTA International. Perkins will be presented the award at the SMTA Annual Meeting by Hutchins Grant Committee Chairperson Laura Turbini, Ph.D., of the University of Toronto.