-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC Releases New Tools for Industry
May 28, 2003 |Estimated reading time: 1 minute
Northbrook, Ill. — IPC — Association Connecting Electronics Industries announces the recent release of three diverse industry products.
IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Boards, establishes requirements and considerations for the design of HDI printed boards and its forms of component mounting and interconnecting structures. Used in conjunction with IPC-2221, Generic Standard on Printed Board Design, this 49-page standard provides recommendations for signal, power, ground and mixed distribution layers, dielectric separation, via formation and metallization requirements and other design features that are necessary for HDI-advanced IC interconnection substrates.
The 15-page IPC-8413-1, Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing, defines standard practices for handling various kinds of optical fiber and the specifications and guidelines to be used in the design of carriers for these fibers in component manufacturing. Documented in the overarching IPC-0040, Optoelectronic Assembly and Packaging Technology, this standard identifies enough parameters to facilitate the use of fiber carriers in optoelectronic component manufacturing, particularly in automated or semi-automated processes.
IPC-DVD-SP54C, ESD Control with Training Certification — Spanish Version, is also now available in a dual-language (Spanish/English) DVD format, superseding the VT-19-SP and VT-19-SP-PAL. The award-winning training program, which was produced in cooperation with the ESD Association, explains the critical information operators need in order to control static charge build-ups and prevent costly damage to electronic components and assemblies. The new DVD format allows students to toggle between English and Spanish narration, for those wishing to learn English terminology of critical electronics assembly skills.
IPC's Online Store houses a vast library of IPC products, including more than 1,000 standards, publications and training sources on electronics assembly, circuit board fabrication and design; more than 440 technical papers submitted at IPCWorks, IPC Annual Meeting, IPC Printed Circuits Expo and IPC SMEMA Council's APEX technical conferences; and more than 4,000 downloadable technical graphic images.
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.