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Epson, Tessera Sign New Licensing Agreement
April 28, 2003 |Estimated reading time: 1 minute
San Jose, Calif. and Japan -- Tessera Inc. has formed a new technology licensing agreement with Seiko Epson ("Epson").
Epson plans to use Tessera's advanced semiconductor packaging technology in ASICs and specialty memory products targeted towards mobile products, consumer products and high-performance computing markets.
The addition of Epson to Tessera's licensee family reflects Tessera's strategy to proliferate advanced packaging technology industry-wide. Included in Tessera's license with Epson are a diverse set of patents covering Tessera's "Compliant Chip" technology. This technology covers a broad range of chip-scale and multi-die package types, including integrated circuit devices packaged in "face-down," "face-up" and "system-in-package" (SiP) formats. These package types are marketed by Tessera as microBGA for face-down orientations, microBGA-F for face-up orientations and microZ(tm) for SiP solutions. Tessera's intellectual property is used in many forms of chip-scale packaging, covering a wide range of materials and assembly processes.
Tessera is the high-tech industry's premier provider of intellectual property and services that enable the semiconductor industry to develop smaller, faster, and more reliable electronic products. For more information, visit www.tessera.com.
Seiko Epson is a progressive company that increases its corporate value through its innovative and creative culture. The company's main product lines comprise information-related equipment such as printers and projectors, electronic devices including semiconductors, LCDs and crystal devices, and precision products, such as watches.