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AIM Acquires SMT Solder Paste Assets of OMG's Microbond Division
December 11, 2002 |Estimated reading time: 1 minute
Cranston, R.I. -- AIM has acquired the SMT solder paste assets of OMG's Microbond division.
The assets include all SMT solder paste manufacturing equipment and intellectual property from OMG's Research Triangle Park (RTP) facility in Raleigh, N.C.The Microbond SMT line includes no-clean, water soluble and RMA solder pastes produced in a variety of solder alloys, including lead-free alloys. These products allow broad process latitudes and robust print and reflow profiles, enabling them to accommodate a wide variety of SMT applications. Microbond SMT solder pastes will continue to be available without disruption from AIM. AIM will manufacture Microbond SMT solder pastes using the same equipment, raw materials, procedures and quality standards, ensuring a seamless transition for current OMG customers. Customers will benefit from increased product availability, enabling the purchase of Microbond SMT solder pastes directly from AIM or through AIM's global sales network. AIM is a leading global manufacturer of assembly materials for the electronics industry. The ISO 9001 and QS 9000 certified company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms and specialty alloys such as indium and gold for the electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit www.aimsolder.com.