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NPL Launches Ultra Fine Pitch Printing Report
November 19, 2002 |Estimated reading time: Less than a minute
Teddington, UK -- The National Physical Laboratory (NPL) has released a new report, "Design Guidelines for Ultra Fine Pitch Printing," written by Martin Wickham, Ling Zou, Milos Dusek and Chris Hunt, Ph.D.
Competitive pressures to reduce equipment size and to maximize circuit performance have resulted in new challenges for ultra fine pitch solder paste printing. The ratio between the open area of the stencil aperture and the area of the aperture wall (AAR) significantly affect the quality of solder paste printing. The AARs for today's ultra fine pitch components printing are below 0.5, and much lower than that for coarser pitch components such as SOIC (above 1.5).
To overcome this ratio reduction and to improve printing performance through ultra fine pitch apertures, all aspects of the print process required a great deal of attention to achieve optimization. The design guidelines for ultra fine pitch solder paste printing are considered, and the effect of stencil type, stencil wall aperture finish, aperture design and paste choice on printing are investigated.
For more information, visit www.npl.co.uk.