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Newport to Present on Advanced Packaging, Automated Assembly at IMAPS Workshop
October 10, 2002 |Estimated reading time: 1 minute
Irvine, Calif. -- Daniel F. Crowley, director of sales at Newport/MRSI, a Newport Corp. company, is scheduled to make a presentation on advanced packaging and automated assembly at the Topical Workshop on Optoelectronics Packaging and Micro-Optoelectromechanical Systems (MOEMS), taking place October 8 through 11, 2002.
The workshop, sponsored by the International Microelectronics and Packaging Society (IMAPS), is being held at the Hotel Bethlehem, in Bethlehem, Pa. This workshop will focus on recent advances in optoelectronics and packaging of optoelectronic devices and associated technologies, and will include a special session on MOEMS. The program will feature internationally recognized speakers from industry, academia and government.Crowley's presentation will explain how standard automation technologies previously developed for semiconductor and advanced packaging are applied in photonics manufacturing. The presentation will cover the concepts of fluid dispense, die bonding and integrated production lines, with a focus on how they lend themselves to photonics manufacturing applications. Crowley will also describe the process and methods for automated eutectic bonding, and will provide details on achieving eutectic bonds such as inert environment, dedicated collets, scrub parameters, and accuracy. Laser submounts and butterfly packages will be used to demonstrate how these assembly techniques apply to the specific requirements of photonics. The presentation will include photos and videos of actual equipment and components being eutectically bonded.Newport Corp. is a leading global supplier of advanced technology products and systems to the semiconductor, communications, electronics and research markets. For more information, visit www.newport.com.